Space Heritage - Thin Film Microwave Hybrids

FEI had been designing and producing space-qualified, high reliability hybrids for over a decade. A partial listing of programs that FEI hybrids have supported include:
Program
Product
MILSTAR RF Amplifiers
LO Amplifiers
DSP Power Amplifiers
Frequency Converters
1H563 MIC Amplifier
BATSON Transfer Switches
RF Amplifiers
SYSTEM 9 Switches
Detectors
ACTS Switches
Amplifiers
LANDSAT Frequency Converters
Shuttle Amplifiers
TDRS Frequency Converters
Amplifiers
Space Station Frequency Converters

 

 

A partial listing of FEI Hybrids for non-space programs are:

Airborne Military Missiles
F-14
F-15
B-1B
AMRAAM
MIS PEACEKEEPER
HAWK
PATRIOT
Shipboard Military Ground Military
TRIDENT II
VERDIN
BRITISH NAVY E.C.
Satellite Ground Stations
JTIDS
PATRIOT Ground Stations
Secure Tactical Communications

Custom Hybrid Capability


Frequency Electronics, Inc. provides a complete custom hybrid capability including:
• Design and Build to Specification
• Build to Print

FEI’s hybrids are designed and manufactured at FEI’s Mitchel Field, New York facility which is fully certified and qualified to ISO-9001. In addition to its extensive commercial and military experience, FEI has been approved to support a variety of USA and foreign government, scientific and commercial space programs.

Design
FEI has a complete modern CAD/CAE capability for all phases of hybrid design, layout and production including:

• System Design and Analysis
• Circuit Design and Analysis
• Mechanical Design
• Layout
• Automated Database Documentation and Control
• Thermal Design
• Reliability Analysis

Functions
FEI has a demonstrated capability for the design and manufacture of hybrids in the following functional categories:

• Analog
• High Power and DC/DC Convertor
• RF
• Microwave
• Millimeter Wave Manufacturing

Technology
FEI has a broad range of manufacturing, test, screening and evaluation capabilities available to satisfy customer requirements in the most cost and schedule effective manner. This capability allows FEI to address conventional hybrids, multi-chip and complex multi-discipline assemblies.

Manufacturing

• Thin Film Circuits (Vacuum Deposition)
• Thick Film Circuits (Ink Screening, Belt Furnace)
• Eutectic Attachment (Chip and Substrate; Belt Furnace and Hot Stage)
• Epoxy Attachment (Chip and Substrate)
• Wire Bonders (Al, Au, 0.7 to 20 mil)
• Gold Ribbon Bonders
• Plasma and Ultrasonic Cleaning Functional Testing
• Manual and Automated Tests
• Thermal Controlled Stations
• DC thru 44 GHz

Environmental Testing

• Thermal
• Thermal Cycling
• Thermal Vacuum
• Vibration
• Shock
• Constant Acceleration
• Radiation Test (off-site)
• EMI/EMC

Product Verification Testing

• Bond Pull
• Die Shear
• X-Ray
• Gross Leak
• Fine Leak
• PIND
• Qualification and Life Testing
• Destructive Physical Analysis (off-site)

Quality Levels (Mil-PRF-38534)

• COTS - Commercial Off The Shelf
• Class H (Equivalent) for Military Applications
• Class K (Equivalent) for High Reliability Space Applications
• Customer Specified Special Screening and Conditioning