MICROWAVE HYBRIDS

 

Space Heritage – Thin Film Microwave
Hybrids

FEI had been designing and
producing space-qualified, high reliability hybrids
for over a decade. A partial listing of programs that FEI hybrids
have supported include:
Program
Product
MILSTARRF Amplifiers
LO Amplifiers
DSPPower Amplifiers
Frequency Converters
1H563 MIC Amplifier
BATSONTransfer Switches
RF Amplifiers
SYSTEM 9Switches
Detectors
ACTSSwitches
Amplifiers
LANDSATFrequency Converters
ShuttleAmplifiers
TDRSFrequency Converters
Amplifiers
Space StationFrequency Converters

A partial listing of FEI Hybrids for
non-space programs are:

Airborne
Military
Missiles
F-14
F-15
B-1B
AMRAAM
MIS PEACEKEEPER
HAWK
PATRIOT
Shipboard
Military
Ground
Military

TRIDENT II

VERDIN
BRITISH NAVY E.C.

Satellite Ground Stations

JTIDS
PATRIOT Ground Stations
Secure Tactical Communications

Custom Hybrid Capability

 

Frequency Electronics, Inc. provides a complete custom hybrid capability
including:
• Design and Build to Specification
• Build to Print

FEI’s hybrids are designed and manufactured
at FEI’s Mitchel Field, New York facility which is fully certified
and qualified to ISO-9001. In addition to its extensive commercial
and military experience, FEI has been approved to support a variety
of USA and foreign government, scientific and commercial space programs.

 

Design

FEI has a complete modern CAD/CAE capability for all phases of hybrid
design, layout and production including:
• System Design and Analysis
• Circuit Design and Analysis
• Mechanical Design
• Layout
• Automated Database Documentation and Control
• Thermal Design
• Reliability Analysis

Functions
FEI has a demonstrated capability for the design and manufacture
of hybrids in the following functional categories:
• Analog
• High Power and DC/DC Convertor
• RF
• Microwave
• Millimeter Wave Manufacturing

Technology
FEI has a broad range of manufacturing, test, screening and evaluation
capabilities available to satisfy customer requirements in the most
cost and schedule effective manner. This capability allows FEI to
address conventional hybrids, multi-chip and complex multi-discipline
assemblies.

Manufacturing

• Thin Film Circuits (Vacuum Deposition)
• Thick Film Circuits (Ink Screening, Belt Furnace)
• Eutectic Attachment (Chip and Substrate; Belt Furnace and Hot Stage)
• Epoxy Attachment (Chip and Substrate)
• Wire Bonders (Al, Au, 0.7 to 20 mil)
• Gold Ribbon Bonders
• Plasma and Ultrasonic Cleaning Functional Testing
• Manual and Automated Tests
• Thermal Controlled Stations
• DC thru 44 GHz

Environmental Testing

• Thermal
• Thermal Cycling
• Thermal Vacuum
• Vibration
• Shock
• Constant Acceleration
• Radiation Test (off-site)
• EMI/EMC

Product Verification Testing

• Bond Pull
• Die Shear
• X-Ray
• Gross Leak
• Fine Leak
• PIND
• Qualification and Life Testing
• Destructive Physical Analysis (off-site)

Quality Levels (Mil-PRF-38534)

• COTS – Commercial Off The Shelf
• Class H (Equivalent) for Military Applications
• Class K (Equivalent) for High Reliability Space Applications
• Customer Specified Special Screening and Conditioning

 

 

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